BGA Repackaging Stencil Template for S20, Stainless Steel

[PRECISE COMPATIBILITY] This BGA reballing jig is specifically designed for the S20 series, including the G988U, G988B, and BR models. It supports Snapdragon 865, SM8250, and 990 processors, ensuring a perfect fit for your reballing needs. [FAST TINNING SPEED] Experience fast tinning with this reballing jig that maintains its shape at high temperatures. The ball stencil remains stable and offers precise positioning for consistent results every time. [HALF-ETCH DESIGN] The jig features a half-etching process with multiple IC grooves that effectively prevent small ICs from sticking to the tin. This innovative design protects delicate components from breakage at the corners during reballing. [DURABLE STAINLESS STEEL] Made from premium stainless steel, this reballing jig is wear-resistant and durable. deformation. Its robust construction guarantees a long service life even with frequent professional use. [COMPACT AND PORTABLE] This rework net is compact and lightweight, making it easy to carry on job sites or store in your toolbox. Despite its small size, it offers reliable performance for your BGA rework projects.