BGA Repacking Station, Automatic Magnetic Stencil, Soldering Touch-Up Kit, High-Precision Aluminum Alloy Soldering Station for Electronic Repair

[Wide Compatibility] Fits 80*80 mm and 90*90 mm stencils, making it suitable for a range of projects. [Self-Centering Function] Simplifies the reballing process by accurately aligning chips. [Versatile Stencil Compatibility] Compatible with various BGA stencil sizes for different applications. [High Accuracy and Efficiency] Provides precise placement and fast clamping speed for efficient work. [Aluminum Alloy Structure] Ensures longevity and reliability for repeated use.

Specifications:

Features: Aluminum alloy structure, lightweight and durable. It has a self-centering function. Rotate the spiral plate; four positioning holes and four clamping blocks lock the chip simultaneously, eliminating the need for individual adjustments. Provides good positioning accuracy, fast clamping speed, and high efficiency.

The station can accommodate various stencils that can be used for corresponding BGAs of different sizes. It can accommodate 80*80 mm and 90*90 mm stencils (not included), offering high efficiency and wide compatibility. Specifications: Model: WN8090 Material: Aluminum Alloy Suitable Stencil Holder: 80 mm*80 mm, 90 mm*90 mm Weight: 635 g (approx.) Package Includes: 1 x Repacking Station (stencils are NOT included) 5 x Screws 1 x Hex Key