BGA Rework Station Diagonal Jig for CPU Phone Soldering Kits HT-90

Discover our BGA reflow and balling station, an essential tool for repair and hand soldering enthusiasts. Made from lightweight yet robust aluminum alloy, its structure guarantees a long service life. This universal solder bead holder, made entirely of electrolytic aluminum alloy, resists oxidation and is perfectly suited for BGA chips ranging in size from 9mm to 43mm. Its use is simple and efficient: adjust the chip size using the dedicated knob and position the discharge chute to easily remove excess solder. Ideal for BGA reflow and hand soldering on laptop CPUs, mobile phones, and other digital products. This complete kit allows you to work independently and is particularly suitable for DIY enthusiasts. It includes everything you need to start your projects.

**Product Details:**

* **Item Type:** BGA Reflow and Ball-Fitting Station

* **Product Material:** Aluminum Alloy + Stainless Steel

* **Set Specifications:** HT-90 Tin Placement Stand, 10 Universal 90 Steel Jigs.

* **Chip Application:**

* Smallest Chip Fit: Approx. 9 x 9 mm / 0.4 x 0.4 inches

* Largest Chip Fit: Approx. 43 x 43 mm / 1.7 x 1.7 inches

* **Application:** Manual BGA soldering for reflow and tin-fixing work on CPUs in laptops, mobile phones, and digital products.

**Package Contents:**

* 1 x BGA Ball Retrieval Station (consisting of 2 accessories)

* 1 x Hex Key

* 10 x Universal Steel Templates