BGA Solder Reballing Balls Soldering Rework Repair Tools

1、Eco‑friendly, bright and full solder joint, little smoke, no irritating smell.

2、Strong welding force, widely used in all kinds of electronic products.

3、Easy to weld, no false welding. 25000pcs/bottle for enough use.

4、Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm

5、Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.

Features:

Eco-friendly, bright and full solder joint, little smoke, no irritating smell.

Strong welding force, widely used in all kinds of electronic products.

Easy to weld, no false welding. 25000pcs/bottle for enough use.

Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm

Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.

Specification:

Material: tin

Solder flux content: 63%

Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm(Optional)

Melting point: 183℃

Operating temperature: 200~380℃

Bottle size: 35mm / 1.4in (high ); 16mm / 0.6in (width)

Quantity: 25000pcs/bottle

Package List:

1Bottle x Soldering Ball

Note:

There are 25,000 pieces/bottle. The bottle size is fixed. The larger the diameter of the ball, the greater its load.