Electronic Solder Paste Syringe Sn42 Bi58 Solder Melting Point 183, Medium Temperature, No-Clean Solder Paste, Suitable for Soldering BGA IC Electronic Components

General description The Electronic Solder Paste Syringe is designed for efficient soldering of BGA IC electronic components. It features a solder paste with an alloy composition of Sn42% and Bi58%, melting at a temperature of 183℃. This no-clean solder paste is ideal for various applications, including circuit boards, motors, lighting, ICs, household appliances, and more. Technical specifications Alloy composition: Sn42%/Bi58% Melting point: 183℃ Net content: 20g/0.7oz Grid size: 20 microns - 38 microns Tin particle size: suitable for electronic repair needs Compatibility and accessories Includes 1 solder paste syringe Includes 1 piston Includes 2 dispensing heads of different sizes for versatile usage Usage Ideal for repairing or assembling circuit boards, televisions, radios, and DIY appliances Allows for flexible control of solder amount to minimize waste during welding Other information This product may expose you to chemicals known to the State of California to cause cancer or birth defects or other reproductive harm. Manual measurement may result in slight size errors. Colors may vary slightly due to different screen displays. Contains small parts; keep away from children.