MCN-UV50 Soldering Flux Electric Soldering Iron Flux Paste Tin Solder Flux for PCB / BGA / PGA / SMD

General Description High-quality soldering flux designed to deliver excellent performance. This flux allows for easy and durable soldering, with quick cleanup and good insulation. It is non-corrosive to integrated circuit boards, ensuring worry-free use. Technical Specifications Mode: UV50 Color: Yellow Viscosity: 0.2 Pa·s Granularity: 0.22 µm Weight: Approximately 35 g Boiling Point: Slightly higher than that of solder tin Installation Wipe the surface of the object before soldering. Apply the flux paste to the solder joint. Solder the tin to the solder joint with a soldering iron. Use This soldering flux is ideal for PCB, BGA, PGA, and SMD applications, facilitating the soldering process without requiring additional cleanup.