MCN-UV50 Soldering Flux Electric Soldering Iron Flux Paste Tin Solder Flux for PCB / BGA / PGA / SMD

General Description

High-quality soldering flux, designed to offer excellent performance. This flux allows for easy and durable soldering, with quick cleanup and good insulation. It is non-corrosive to integrated circuit boards, ensuring worry-free use.

Technical Specifications

• Mode: UV50
• Color: Yellow
• Viscosity: 0.2 Pa·s
• Particle Size: 0.22 µm
• Weight: Approximately 35 g
• Boiling Point: Slightly higher than that of solder

Installation

• Wipe the surface of the object before soldering.
• Apply the flux paste to the solder joint.
• Solder the solder to the joint with a soldering iron.

Use

This solder flux is ideal for PCB, BGA, PGA, and SMD applications, facilitating the soldering process without the need for cleanup. additional.