Repacking kit, BGA repacking station, practical, lightweight, durable, robust, for soldering station - stencils - ball kit for rework kit

Features: Made of aluminum alloy, the structure is lightweight and durable. The top cover has a groove for easy removal of excess solder balls. This reballing station can be used with various stencils. It can accommodate BGA chips of different sizes, with a maximum chip size of 50 x 50 mm. The BGA chip supports steel stencils measuring 90 x 90 mm. Specifications: Material: Aluminum alloy; Solder ball sizes: 0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm; Weight: Approximately 635 g. Package includes: 1 x BGA reballing station with handles (90 x 90 mm); 9 x steel stencils; 4 x bottles of solder balls (0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm); 1 x desoldering drill bit; 1 x brush; 1 x tap; 1 x razor pen; 1 x hex key