Soldering Flux Paste Solder Welding Grease for Cell Phone PCB PGA BGA (CMt 150+)

1、Good moisturizing, bright and full solder joint, little smoke, no irritating smell.

2、Less residual, high insulation resistance.

3、High bonding strength, neutral PH value, smooth welding surface.

4、Easy to weld, no false welding.

5、Suitable for mobile phone, PC board card and other precision electronic chip welding.

Features:

Good moisturizing, bright and full solder joint, little smoke, no irritating smell.

Less residual, high insulation resistance.

High bonding strength, neutral PH value, smooth welding surface.

Easy to weld, no false welding.

Suitable for mobile phone, PC board card and other precision electronic chip welding.

Specification:

Item: Solder Paste

Optional Weight: #01 84g/3oz; #02 50g/1.8oz

Model: CMT-150+; CMT-50 (Optional)

Package List:

1 x Solder Paste

Note:

Before welding, wipe the surface of the goods, drop the paste on the welding place, and then use soldering iron to melt tin on the welding place.