Spool of Lead-Free Solder Wire 0.8mm, Sn99-Ag0.3-Cu0.7 Alloy, 2% Rosin Flux, For Electronics

Diameter: 0.8 mm

Weight: 250 g

Composition: Sn99%-Ag0.3%-Cu0.7%

Flux: 2.0%

Melting Temperature: 217°C This lead-free solder wire offers excellent conductivity for your electronics work. With a diameter of 0.8 mm and integrated rosin flux, this wire ensures bright and strong joints on your PCB circuits. The tin, silver, and copper composition guarantees a uniform melting point of 217°C. Ideal for repairing electrical equipment and precise DIY projects requiring a reliable wire.

The solder wire is composed of Sn99%, Ag0.3%, and Cu0.7% with 2.0% flux, providing an economical and environmentally friendly solution for all your electrical connection needs.

With a diameter of 0.8 mm and a low melting point of 217°C, this wire allows for fast soldering that reduces thermal shock to sensitive electronic components during assembly. Unlike grayish lead wires, this lead-free wire has a brighter color and ensures smooth flow of molten metal for clean, flawless solder joints. This product is designed for versatile use on printed circuit boards, IC chips, and various electronic devices, making fine repair and DIY projects easier. Please note that the 250 g weight may vary by ±0.5 g due to manual measurement, and it is recommended to use a soldering iron between 350°C and 450°C for optimal melting.