Tin repackaging stencil for telephone, half-etching process, CPU planting template, mesh for the A53 series

Features:1. Applicable Models: The CPU tin plating stencil is applicable to the A53 and A536 series with a 0.12 mm pitch.
2. Fast Tinning Speed: Our tin reballing stencil will not change under high temperatures and at high tinning speed, thus improving tin plating efficiency.
3. Half-Etching Process: The tin stencil is equipped with several IC recesses on the stencil body using a half-etching process, which effectively prevents small ICs from sticking to the tin and protects them from chipped corners.
4. Precise Positioning: The tin stencil can be positioned precisely and has a compact design, allowing you to use it in various situations.
5. Easy to use: The CPU tin plating stencil is very portable, you can use it on the go, it's easy to operate, and it's a good maintenance and DIY tool.
Specifications:Item Type: PHONE REWRAPPER
Material: Stainless steel
Pitch: Approx.0.12 mm / 0.005 inches
Applicable Models: Suitable for A33 A53 A536 A13 A21S F13 M33, etc.

How to use:Direct to use.
Package List:1 x Phone Tin Rewrap Stencil