Tin Solder Paste BGA Soldering Flux Repairing Tool Accessories

1、Good moisturizing, bright and full solder joint, little smoke, no irritating smell.

2、Less residual, high insulation resistance, high activity, strong welding force.

3、Easy to weld, can protect BGA traces from corrosion and moisture.

4、Good wetting, dry resistance, long shelf life at room temperature

5、Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.

Features:

Good moisturizing, bright and full solder joint, little smoke, no irritating smell.

Less residual, high insulation resistance, high activity, strong welding force.

Easy to weld, can protect BGA traces from corrosion and moisture.

Good wetting, dry resistance, long shelf life at room temperature

Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.

Specification:

Viscosity: 200 (Pa. S)

Granularity: 24-45 (um)

Product size: 37 * 20mm / 1.5 * 0.8in

Alloy components: Sn63

Activity: high activity

Melting point: 183℃

Temperature: 220~380℃

Package List:

1 x Solder Paste