Aluminium Alloy BGA Rebolling Station, Precise Placement, Universal Design, Efficient Functionality, Lightweight, Ideal for Manual Soldering of Laptops and Phones

1. This reballing station adopts an aluminum alloy material for its structure and light. 2. This product is a universal diagonal BGA ball-planting fixture with all aluminum alloy plating. 3. Not easy to oxidize, more wear-resistant, and more suitable for planting BGA chip balls from 9mm to 43mm. 4. Adjust the chip size knob and set the diverter groove to facilitate tin bead casting. 5. Used for laptop processors and mobile phone digital products in factories reworking with manual BGA soldering. Specification: Item Type: BGA Reballing Station Product Model: HT-90 90x90 Applicable Steel Mesh: Approx. 90 x 90 mm / 3.5 x 3.5 inches Application Inch: Minimum clamping chip: Approx. 9 x 9 mm / 0.4 x 0.4 inch, Maximum clamping chip: Approx. 43 x 43 mm / 1.7 x 1.7 inch Material: Aluminum alloy Application: Manual BGA soldering for tin rework of laptop CPUs and mobile phone digital products. Packing list: 1 x BGA stage, 1 x Hex wrench, 1 x BGA reflow station, 1 x Hex key