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Electronic Solder Paste Syringe Sn42 Bi58 Solder Melting Point 183, Medium Temperature, No-Clean Solder Paste, Suitable for Soldering BGA IC Electronic Components

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Product information

Description

General description

The Electronic Solder Paste Syringe is designed for efficient soldering of BGA IC electronic components. It features a solder paste with an alloy composition of Sn42% and Bi58%, melting at a temperature of 183℃. This no-clean solder paste is ideal for various applications, including circuit boards, motors, lighting, ICs, household appliances, and more.

Technical specifications

  • Alloy composition: Sn42%/Bi58%
  • Melting point: 183℃
  • Net content: 20g/0.7oz
  • Grid size: 20 microns - 38 microns
  • Tin particle size: suitable for electronic repair needs

    • Compatibility and accessories

  • Includes 1 solder paste syringe
  • Includes 1 piston
  • Includes 2 dispensing heads of different sizes for versatile usage

    • Usage

  • Ideal for repairing or assembling circuit boards, televisions, radios, and DIY appliances
  • Allows for flexible control of solder amount to minimize waste during welding

    • Other information

  • This product may expose you to chemicals known to the State of California to cause cancer or birth defects or other reproductive harm.
  • Manual measurement may result in slight size errors.
  • Colors may vary slightly due to different screen displays.
  • Contains small parts; keep away from children.

    • Features

    • Brand
      COOCHEER
    • Material
      Tin
    • Pcs per pack
      1 .
    • Type of solder/braze flux
      Soldering paste
    • ManoMano Reference
      ME89269885
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