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Electronic Solder Paste Syringe Sn42 Bi58 Solder Melting Point 138 Low Temperature No-Clean Solder Paste Suitable for Soldering Electronic BGA IC Components

Product information

Description

General description

The Electronic Solder Paste Syringe is designed for low-temperature soldering, featuring an alloy composition of Sn42% and Bi58%. With a melting point of 138℃, this no-clean solder paste is ideal for soldering electronic BGA IC components and other applications.

Technical specifications

Alloy composition: Sn42%/Bi58%

Melting point: 138℃

Net content: 20g/0.7oz

Grid size: 20 microns - 38 microns

Tin particle size: suitable for electronic repair needs

Compatibility and accessories

Includes 1 solder paste syringe

Includes 1 piston

Includes 2 dispensing heads of different sizes for versatile usage

Usage

Ideal for soldering circuit boards, motors, lighting, ICs, household appliances, sensors, wires, fuses, mobile phones, and connectors

Suitable for surface mount technology maintenance

Helps in repairing or assembling devices like televisions and radios

Other information

This product may expose you to chemicals known to the State of California to cause cancer or birth defects or other reproductive harm

Manual measurement may result in slight size errors

Colors may vary slightly due to different screen displays

Contains small parts; keep away from children

Features

Brand
COOCHEER
NF certification
NF138
Pcs per pack
1
Suitable for metal 3D printing
No
Suitable for
Metal

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