Instead of Taiwan Baogong DP-366D double-opening, double-ring tin suction device

General description

This is a manual suction cup for effectively removing solder when repairing and soldering electronic components. Compact and portable, this tool is ideal for correcting errors on small circuit boards and other components.

Technical specifications

• Material: ABS
• Color: black and green
• Suction power: 35 cm-hg
• Item size: 208 x 21 mm (8.19 x 0.83 in)
• Package size: 250 x 60 x 30 mm (9.84 x 2.36 x 1.18 in)
• Package weight: 150 g (5.29 oz)

Usage

Easy to use: press the tin suction control button and push the plunger down at the same time to remove the solder joint.For best desoldering results, push the plunger all the way in, quickly bring the tool tip close to the solder joint, and press the control button while moving your soldering iron.

Other Information

• The nylon tip is high-temperature resistant, replaceable, easy to clean, and portable.
• The ABS plastic casing is sturdy and durable.
• The sponge-covered handle is non-slip and comfortable to grip.
• Double-layer air leak protection provides a good airtight seal.